I. C 磨 字 机

I. C Letter Grinding Machine

特 点：

1.彻底磨除IC表面字体,防止机板被仿冒

2.採用自动入料、收料,不须经人手接触,防止静电干扰

3.特殊砂轮片研磨,表面不发烫,可微调研磨深度

4.装有砂轮校正器,可随时校正砂轮片平面度

5.体积小,生產效率高,一台可抵5个作业员

6.适用DIP型IC,SMD型SOP SOJ PLCC,以及电晶体型TO22 TO-36 TO-26等IC磨字

Features ：

1.To be able thoroughly grind off the letters on the surface of IC to prevent the circuit board from being .counterfeited.

2.To use automatic material feeding and recovering without hand touching the material to prevent form electrostatic interference.

3.To grind with special grinding wheel plate without causing surface being heated, the depth of the grinding may be, micro-adjusted.

4.To fit with diamond rectify to adjust the plane of the grinding wheel plate at any time when necessary.

5.With small volume and high production efficiency, the productivity of one machine is equivalent to five skilled labors.

6.The machine is suitable for D. I .P IC type and S.M.D. IC type (SOP. SOJ and PLCC type etc.